The present numerical tool is then thought valuable to perform virtual tests Temperature for the sintering, for instance. Show that the description is able to capture the damage induced by the process cooling, thus providing insight of the appropriate The presence of defects at these junctions and their influence on the crack propagation is then investigated. The triple junctions are shown to be key in the resistance to crack ![]() Of intergranular failure in a 2D plane strain polycrystal. Involved in the cohesive zone formulation can be determined to capture SCG in a single crystal. We proposeĪ physically based cohesive zone description that mimics the reaction-rupture process underlying SCG. The clarification of the origin of the latter observation motivates the development of a local approach of fracture. ![]() Marked increase in the resistance to the crack advance when comparing the response of a single crystal to that of a polycrystal. ![]() However, evidences are available on the influence of the microstructure on the SCG rate with a The kinetics of fracture are known to be dependent on the load level, the temperature and also on Ceramics polycrystals are subjected to slow crack growth (SCG) and also environmentally assisted failure, similarly to what
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